Localization of defects in die-attach assembly by continuous wavelet transform using scanning acoustic microscopy

Highly reliable Au-Sn eutectic bonding with background GaAs LSI chips

M. Nishiguchi, N. Goto, Hideyuki Nishizawa · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1991 · 35 citations

Engineering, Materials Engineering, Materials Science +17

Thin thickness measurements by means of a wavelet transform-based method

Leopoldo Angrisani, Pasquale Daponte · Measurement · 1997 · 32 citations

Engineering, Materials Engineering, Materials Characterization +8

Substrate-to-base solder joint reliability in high power IGBT modules

E. Herr, T. Frey, R. Schlegel et al. · Microelectronics Reliability · 1997 · 31 citations

Engineering, Electrical Engineering, Materials Science +14

Detection of echoes using time-frequency analysis techniques

Pasquale Daponte, Giuseppe Fazio, A. Molinaro · IEEE Transactions on Instrumentation and Measurement · 1996 · 30 citations

Natural Sciences, Electrical Engineering, Acoustics +16

Detection of echoes in noisy environments for multilayer structure characterization

G. Betta, Pasquale Daponte · IEEE Transactions on Instrumentation and Measurement · 1993 · 22 citations

Natural Sciences, Materials Engineering, Acoustics +9