Kinetics of AuSn4 migration in lead-free solders

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.3K citations

Reliability, Electrical Engineering, Reliability Engineering +10

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

Materials Science, Interfacial Reactions, Engineering +4

Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish

Cheng–En Ho, Ruixiao Zheng, Gan Luo et al. · Journal of Electronic Materials · 2000 · 121 citations

Materials Science, Materials Engineering, Engineering +6

Reactions between Sn–Ag–Cu lead‐free solders and the Au/Ni surface finish in advanced electronic packages

Li-Chan Shiau, Cheng–En Ho, C. R. Kao · Soldering and Surface Mount Technology · 2002 · 108 citations

Materials Engineering, Materials Science, Chemical Engineering +15

Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging

Andrew M. Minor, J. W. Morris · Metallurgical and Materials Transactions A · 2000 · 84 citations

Materials Engineering, Materials Science, Surface Characterization +8