C. W. Chang

Controlling the microstructure from the gold-tin reaction

Jang‐Zern Tsai, C. W. Chang, Y. C. Shieh et al. · Journal of Electronic Materials · 2005 · 106 citations

Materials Science, Engineering, Nanotechnology +7

Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

Shun‐Chung Yang, Cheng–En Ho, C. W. Chang et al. · Journal of materials research/Pratt's guide to venture capital sources · 2006 · 95 citations

Materials Science, Chemical Engineering, Engineering +6

Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element

Shun‐Chung Yang, Cheng–En Ho, C. W. Chang et al. · Journal of Applied Physics · 2007 · 45 citations

Materials Science, Materials Engineering, Active Element +15

Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates

Jang‐Zern Tsai, C. W. Chang, Cheng–En Ho et al. · Journal of Electronic Materials · 2006 · 40 citations

Materials Science, Materials Engineering, Engineering +12

Kinetics of AuSn4 migration in lead-free solders

C. W. Chang, Cheng–En Ho, Shun‐Chung Yang et al. · Journal of Electronic Materials · 2006 · 25 citations

Materials Science, Engineering, Ausn4 Migration +6