Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

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K. N. Tu, R. D. Thompson · Acta Metallurgica · 1982 · 468 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

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Natural Sciences, Materials Engineering, Materials Science +13

Interfacial reaction issues for lead-free electronic solders

Cheng–En Ho, Shenghao Yang, C. R. Kao · Journal of Materials Science Materials in Electronics · 2006 · 272 citations

Natural Sciences, Materials Engineering, Materials Science +12

Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems

S. Bäder, W. Gust, H. Hieber · Acta Metallurgica et Materialia · 1995 · 221 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders

W. T. Chen, Cheng–En Ho, C. R. Kao · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 210 citations

Engineering, Materials Engineering, Materials Science +14