Electroless deposition of NiWB alloy on p-type Si(100) for NiSi contact metallization

Surface energy, surface topography and adhesion

D. E. Packham · International Journal of Adhesion and Adhesives · 2003 · 579 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +14

Towards implementation of a nickel silicide process for CMOS technologies

C. Lavoie, F. M. d’Heurle, Christophe Detavernier et al. · Microelectronic Engineering · 2003 · 406 citations

Engineering, Electrical Engineering, Materials Engineering +12

Silicides and ohmic contacts

J. Gambino, E. G. Colgan · Materials Chemistry and Physics · 1998 · 389 citations

Natural Sciences, Materials Science, Physics +7

Metal Silicides in CMOS Technology: Past, Present, and Future Trends

Shi‐Li Zhang, Mikael Östling · Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences · 2003 · 364 citations

Engineering, Electrical Engineering, Materials Science +17

Salicidation process using NiSi and its device application

F. Deng, Rob Johnson, P.M. Asbeck et al. · Journal of Applied Physics · 1997 · 154 citations

Engineering, Electrical Engineering, Materials Science +17