A 172mm<sup>2</sup> 32Gb MLC NAND flash memory in 34nm CMOS

R.W. Zeng, N. Chalagalla, D. Chu, D. Elmhurst, M. Goldman, C. Haid, A. Huq, O. Jungroth, N. Kajla, R.S. Kajley,

2009 · 10 citations · 5 references

Abstract

As applications for NAND continue to grow and cost remains a primary market driver, it is necessary to deliver increased storage capacities at smaller process lithography while meeting high performance requirements. Design plays a pivotal role by providing architectures and design solutions that minimize the impact of bitline and wordline resistance and capacitance (RC) requirements and cell-reliability constraints. This paper presents a device that employs chip architecture, datapath, and analog architecture solutions that address these challenges while meeting high performance requirements. This 32 Gb MLC NAND delivers 50 mus t <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">READ</sub> , 900 mus t <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">PR0G</sub> and 9 MB/s write throughput in a 34 nm technology.

References

5