Investigation of the effects of byproduct components in Cu plating for advanced interconnect metallization

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

Engineering, Chemical Deposition, Interconnect (Integrated Circuits) +18

The chemistry of the additives in an acid copper electroplating bath

John P. Healy, Derek Pletcher, Mark Goodenough · Journal of Electroanalytical Chemistry · 1992 · 251 citations

Materials Science, Electrometallurgy, Chemical Engineering +6

Theory of Filling of High-Aspect Ratio Trenches and Vias in Presence of Additives

Alan C. West · Journal of The Electrochemical Society · 2000 · 149 citations

Engineering, Mechanical Engineering, Computer-aided Design +19

The chemistry of the additives in an acid copper electroplating bath

John P. Healy, Derek Pletcher, Mark Goodenough · Journal of Electroanalytical Chemistry · 1992 · 131 citations

Materials Science, Electrometallurgy, Chemical Engineering +6

Model studies on the coordination of copper in enzymes. IV. Structure and stability of cuprous complexes with sulfur-containing ligands

Volker VORTISCH, Peter M. H. Kroneck, Peter Hemmerich · Journal of the American Chemical Society · 1976 · 53 citations

Engineering, Chemical Analysis, Altmetric Attention Score +17