Gold Stud Bumps Flip-Chip Bonded onto Copper Electrodes with Titanium and Silver Layers

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 117 citations

Materials Science, Different Bonding Temperature, Flip-chip-on-flex Packages +10

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 113 citations

Materials Science, Flip-chip-on-flex Packages, Chip-scale Package +11

Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding

Jong-Ning Aoh, Cheng-Li Chuang · Journal of Electronic Materials · 2004 · 33 citations

Electrical Engineering, Engineering, Corrosion +6

Thermosonic bonding of gold wire onto a copper pad with titanium thin-film deposition

Jong-Ning Aoh, Cheng-Li Chuang · Journal of Electronic Materials · 2004 · 27 citations

Materials Science, Materials Engineering, Engineering +9

Increasing bondability and bonding strength of gold stud bumps onto copper pads with a deposited titanium barrier layer

Cheng-Li Chuang · Microelectronic Engineering · 2006 · 25 citations

Materials Engineering, Materials Science, Gold Stud Bumps +9