Concepedia

Cheng-Li Chuang

CC

8

Publications

185

Citations

8

H-Index

2004

Active since

Affiliations

National Chung Cheng University(Current)

Chung Shan Medical University

Industrial Technology Research Institute

Chung Shan Medical University Hospital

ITRI International

Cheng-Li Chuang is an author at National Chung Cheng University specializing in engineering, applied physics, and materials science.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMaterials EngineeringElectronic PackagingSurface ScienceCorrosionMicroelectronicsMechanical EngineeringMicrofabrication

Publications per year

2004–2017

8

Publications

8

Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process

Cheng-Li Chuang, Jong-Ning Aoh, Rong-Fong Din · Microelectronics Reliability · 2005 · 48 citations

Materials Science, Materials Engineering, Copper Pads +9

Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding

Jong-Ning Aoh, Cheng-Li Chuang · Journal of Electronic Materials · 2004 · 33 citations

Electrical Engineering, Engineering, Corrosion +6

Thermosonic bonding of gold wire onto a copper pad with titanium thin-film deposition

Jong-Ning Aoh, Cheng-Li Chuang · Journal of Electronic Materials · 2004 · 27 citations

Materials Science, Materials Engineering, Engineering +9

Increasing bondability and bonding strength of gold stud bumps onto copper pads with a deposited titanium barrier layer

Cheng-Li Chuang · Microelectronic Engineering · 2006 · 25 citations

Materials Engineering, Materials Science, Gold Stud Bumps +9

Increasing the bonding strength of chips on flex substrates using thermosonic flip-chip bonding process with nonconductive paste

Cheng-Li Chuang, Qing-An Liao, Hsun-Tien Li et al. · Microelectronic Engineering · 2009 · 20 citations

Materials Science, Materials Engineering, Chip-scale Package +12

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