Publication | Closed Access

Increasing the bonding strength of chips on flex substrates using thermosonic flip-chip bonding process with nonconductive paste

Materials ScienceMaterials EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Wafer Scale ProcessingMicrofabricationBonding StrengthNonconductive PasteChip On BoardApplied PhysicsChip AttachmentFlex SubstratesElectronic PackagingMicroelectronics