Concepedia

Qing-An Liao

QL

2

Publications

30

Citations

2

H-Index

2008

Active since

Affiliations

Chung Shan Medical University(Current)

National Chung Cheng University

ITRI International

Industrial Technology Research Institute

Qing-An Liao is an author at Chung Shan Medical University specializing in applied physics, engineering, and electronic packaging.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsElectronic PackagingMaterials EngineeringSurface ScienceMicrofabricationFlexible ElectronicsElectrical Engineering

Publications per year

2008–2009

2

Publications

2

Increasing the bonding strength of chips on flex substrates using thermosonic flip-chip bonding process with nonconductive paste

Cheng-Li Chuang, Qing-An Liao, Hsun-Tien Li et al. · Microelectronic Engineering · 2009 · 20 citations

Materials Science, Materials Engineering, Chip-scale Package +12

Gold Stud Bumps Flip-Chip Bonded onto Copper Electrodes with Titanium and Silver Layers

Cheng-Li Chuang, Jong-Ning Aoh, Qing-An Liao et al. · Journal of Electronic Materials · 2008 · 10 citations

Materials Science, Materials Engineering, Electrical Engineering +11

Rows per page

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