Concepedia

Board level reliability assessment of chip scale packages

Z.P Wang, Y.M. Tan, K.M. Chua

Microelectronics Reliability · 1999 · 21 citations · 1 references

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Concepts

EngineeringComputer EngineeringComputer SystemsFault-tolerant ComputingPackaging DesignSystem-on-chip DesignChip PackagingDevice ReliabilityPackaging EngineeringReliabilityReliability ModelingSemiconductor ReliabilityChip-scale PackagingPackage ReliabilityPackage-level ReliabilityPackaging ReliabilityReliability Assessment

References

1

Bottom leaded plastic (BLP) package: a new design with enhanced solder joint reliability

Young-Gon Kim, Bongtae Han, Shin Choi et al. · 2002 · 11 citations

Engineering, Electrical Engineering, Materials Engineering +17