Effects of dopant, temperature, and strain rate on the mechanical properties of micrometer gold-bonding wire

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Sejin Han, K. K. Wang · Journal of Electronic Packaging · 1995 · 29 citations

Engineering, Materials Science, Mechanical Behavior Of Materials +13

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

Spring H. Han, K. K. Wang, D. L. Crouthamel · Journal of Electronic Packaging · 1997 · 22 citations

Engineering, Materials Engineering, Materials Science +12

Wirebond Deformation During Molding of IC Packages

A.A.O. Tay, K. S. Yeo, Jichuan Wu et al. · Journal of Electronic Packaging · 1995 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +17

Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Molding

E. Suhir, L. T. Manzione · Journal of Electronic Packaging · 1991 · 19 citations

Natural Sciences, Materials Science, Mechanical Behavior Of Materials +13

Effects of fillers on wire sweep in semiconductor chip encapsulation

Spring H. Han, K.K. Wang · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 10 citations

Engineering, Materials Engineering, Materials Science +13