D. S. Liu

Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element method

D. S. Liu, C.H Wang · Finite Elements in Analysis and Design · 2003 · 65 citations

Engineering, Electrical Engineering, Materials Science +14

Effects of dopant, temperature, and strain rate on the mechanical properties of micrometer gold-bonding wire

D. S. Liu · Journal of Electronic Materials · 2003 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +13

A novel honeycomb sandwich cylindrical shell with dual deformation mode for circumferential vibration isolation and enhanced stiffness

Hengtai Ni, Jing Liu, D. S. Liu et al. · Mechanical Systems and Signal Processing · 2025 · 34 citations

Engineering, Materials Science, Mechanical Engineering +16

3D IEM formulation with an IEM/FEM coupling scheme for solving elastostatic problems

D. S. Liu, D. Y. Chiou, Cheng‐Tung Lin · Advances in Engineering Software · 2003 · 18 citations

Engineering, Computational Engineering, Electrical Engineering +13

2-D infinite element modeling for elastostatic problems with geometric singularity and unbounded domain

D. S. Liu, D. Y. Chiou · Computers & Structures · 2005 · 12 citations

Engineering, Computational Engineering, Mechanical Engineering +16