Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies

Solder joint fatigue models: review and applicability to chip scale packages

W.W Lee, Luu Nguyen, Guna S Selvaduray · Microelectronics Reliability · 2000 · 507 citations

Natural Sciences, Materials Engineering, Materials Science +11

Reliability of Controlled Collapse Interconnections

K. C. Norris, Abraham H. Landzberg · IBM Journal of Research and Development · 1969 · 483 citations

Engineering, Electrical Engineering, Heat Transfer +16

Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling

W. Engelmaier · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1983 · 362 citations

Engineering, Materials Engineering, Materials Science +17

Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints

A. Syed · 2004 · 353 citations

Engineering, Materials Engineering, Materials Science +17

Fatigue of 60/40 Solder

H. D. Solomon · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1986 · 300 citations

Natural Sciences, Materials Engineering, Materials Science +17