Concepedia
Journal of Electronic Materials · 1987 · 13 citations · 1 references
Semiconductor DevicesElectrical EngineeringReliability EngineeringEngineeringNon-volatile MemoryHardware ReliabilityMem TestingComputer EngineeringFailure AnalysisSemiconductor MemoryElectronic PackagingDevice ReliabilityMicroelectronics
1
The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-Cracking
Chris van Kessel, S.A. Gee, Jeremiah G. Murphy · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1983 · 93 citations
Engineering, Mechanical Engineering, Residual Stress +17