Sang-Bum Hu

Study of temperature parameter on the thermosonic gold wire bonding of high-speed CMOS

Sang-Bum Hu, Gin-Keat Lim, Thai Li Lim et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1991 · 40 citations

Temperature Parameter, Engineering, Mechanical Engineering +17

Gold wire weakening in the thermosonic bonding of the first bond

Sang-Bum Hu, R.K.S. Lim, G.Y. Sow · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 20 citations

Materials Science, Molecular Solid, Wire Grain Size +11

Highly thermal robust NiSi for nanoscale MOSFETs utilizing a novel hydrogen plasma immersion ion implantation and Ni-Co-TiN tri-layer

Jang-Gn Yun, Soon-Young Oh, Bin-Feng Huang et al. · IEEE Electron Device Letters · 2005 · 14 citations

Engineering, Silicon On Insulator, Semiconductor Device +16

Failure analysis of die-attachment on static random access memory (SRAM) semiconductor devices

S. L. Tan, Kok Wai Chang, Sang-Bum Hu et al. · Journal of Electronic Materials · 1987 · 13 citations

Semiconductor Devices, Electrical Engineering, Reliability Engineering +10