Highly thermal robust NiSi for nanoscale MOSFETs utilizing a novel hydrogen plasma immersion ion implantation and Ni-Co-TiN tri-layer

Abstract

In this letter, hydrogen plasma immersion ion implantation (H PIII) with Ni-Co-TiN tri-layer is introduced for the first time to enhance the thermal stability of the Ni-silicide for nanoscale CMOS technology. The Ni-silicided poly-Si gate and source/drain showed stable sheet resistance in spite of 650/spl deg/C, 30 min post-silicidation annealing. The junction leakage current is even improved a lot without degradation of device performance using the proposed method.