Journal of Vacuum Science and Technology · 1981 · 11 citations · 0 references
EngineeringElectrical EngineeringManufacturing EngineeringMicroelectronicsMicrofabricationSemiconductor DevicesElectron Beam LithographyElectron Beam PhysicsIntegrated Circuit FabricationMask DesignMask FabricationDesign ConstraintsDirect WritingElectron Beam FocusingElectron Beam Mask WritingElectron Beam OpticsMask Layout GenerationRaster Scanning
The Hewlett–Packard electron beam lithography system is described. The system is capable of being used either for direct writing on a wafer or for mask generation. It has been designed for high throughput production applications with data rates up to 300 MHz, using a field emitter electron source, a modified raster scan, and electrostatic deflectors. Deflection field aberrations are corrected so that patterns up to 5 in. square may be exposed with layer to layer registration better than 0.13 microns. The system architecture and design constraints will be discussed.