Concepedia

Integration of copper with an organic low-k dielectric in 0.12-μm node interconnect

M. Fayolle, G. Passemard, M. Assous, D. Louis, Alessio Beverina, Y. Gobil, J. Cluzel, L. Arnaud

Microelectronic Engineering · 2002 · 24 citations · 1 references