Japanese Journal of Applied Physics · 1984 · 87 citations · 34 references
EngineeringElectrical EngineeringMaterials ScienceOptoelectronicsSemiconductor DevicesSemiconductor MaterialsDevice ModelingP-n JunctionsPhotovoltaic DevicesSemiconductor Device MaterialsSemiconductor InterfacesSemiconductor SurfacesChoppingJunction CapacitanceJunction ModelingJunction ResistanceP-n Junction CharacteristicsSilicon WafersSurface Potential AnalysisWafer Materials
Surface photovoltages in Si wafers excited with a chopped 559 nm-wavelength photon beam are analysed using a new half-sided junction model. In this model, the wafer surface with the depletion layer is considered to be one half of the p-n junction. Chopping frequency ranges from 2 Hz through 20 kHz. Four 76 mm-diameter p-type Si wafers having resistivities of 260, 92, 17 and 1.0 mΩ m are used after forming 360 nm-thick wet-oxide layer on their front surfaces. In these wafers, photovoltage increases with resistivity. In three high-resistivity wafers with strongly-inverted surfaces, the inversion capacitances and conductances limit the photovoltages at low frequencies. The obtained inversion time-constant is 7 s for the 17 mΩ m wafer.
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Surface Properties of Germanium
W. H. Brattain, John Bardeen · Bell System Technical Journal · 1953 · 590 citations
Physical Theory of Semiconductor Surfaces
C. G. B. Garrett, W. H. Brattain · Physical Review · 1955 · 558 citations