Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane

Recent advances on electromigration in very-large-scale-integration of interconnects

K. N. Tu · Journal of Applied Physics · 2003 · 1.1K citations

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Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

H. Gan, K. N. Tu · Journal of Applied Physics · 2005 · 267 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

Zhang Lingyun, Shengquan Ou, Joanne Huang et al. · Applied Physics Letters · 2006 · 161 citations

Engineering, Electrical Engineering, Materials Science +15

Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect

Qi‐Liang Yang, Jin Shang · Journal of Electronic Materials · 2005 · 97 citations

Engineering, Materials Engineering, Materials Science +13

Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration

S. H. Chiu, T. L. Shao, Chih Chen et al. · Applied Physics Letters · 2006 · 94 citations

Engineering, Materials Engineering, Materials Science +13