Concepedia

S. H. Chiu

SH

Statistics

Publications

5

Citations

279

H-Index

5

Active since

2004

Affiliations

National Yang Ming Chiao Tung University(Current)

National Tsing Hua University

S. H. Chiu is an author at National Yang Ming Chiao Tung University specializing in engineering, electronic packaging, and heat transfer.

Top concepts

EngineeringElectronic PackagingHeat TransferMicrostructureMaterial ScienceMicroelectronicsApplied PhysicsThermal EngineeringElectrical EngineeringThermodynamics

Publications per year

2004–2007

5

Publications

5

Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads

T. L. Shao, Y. H. Chen, S. H. Chiu et al. · Journal of Applied Physics · 2004 · 105 citations

Engineering, Solder Bump, Current Densities +17

Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration

S. H. Chiu, T. L. Shao, Chih Chen et al. · Applied Physics Letters · 2006 · 93 citations

Friction Welding, Engineering, Mechanical Engineering +20

Thermal gradient in solder joints under electrical-current stressing

T. L. Shao, S. H. Chiu, Chih Chen et al. · Journal of Electronic Materials · 2004 · 31 citations

Electrical Engineering, Engineering, Thermal Gradient +7

Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints

S. W. Liang, S. H. Chiu, Chih Chen · Applied Physics Letters · 2007 · 25 citations

Engineering, Flip-chip Solder Joints, Joule Heating +18

Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy

S. H. Chiu, Chih Chen · Applied Physics Letters · 2006 · 25 citations

Engineering, Flip-chip Solder Joints, Advanced Packaging (Semiconductors) +16

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