S. W. Liang

Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes

Yuan Chang, S. W. Liang, Chih Chen · Applied Physics Letters · 2006 · 71 citations

Engineering, Flip-chip Solder Joints, Mechanical Engineering +16

Three-dimensional simulation on current-density distribution in flip-chip solder joints under electric current stressing

T. L. Shao, S. W. Liang, Tzu-Chun Lin et al. · Journal of Applied Physics · 2005 · 53 citations

Engineering, Flip-chip Solder Joints, Electric Current Stressing +16

Effect of bump size on current density and temperature distributions in flip-chip solder joints

Wei-Chih Kuan, S. W. Liang, Chih Chen · Microelectronics Reliability · 2009 · 31 citations

Electrical Engineering, Bump Size, Engineering +9

Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints

S. W. Liang, S. H. Chiu, Chih Chen · Applied Physics Letters · 2007 · 25 citations

Engineering, Flip-chip Solder Joints, Joule Heating +18

Temperature and current-density distributions in flip-chip solder joints with Cu traces

C. Y. Hsu, D. J. Yao, S. W. Liang et al. · Journal of Electronic Materials · 2006 · 10 citations

Materials Science, Electrical Engineering, Engineering +9