Concepedia

C. Y. Hsu

CY

Statistics

Publications

2

Citations

41

H-Index

2

Active since

2004

Affiliations

National Tsing Hua University(Current)

C. Y. Hsu is an author at National Tsing Hua University specializing in electronic packaging, heat transfer, and engineering.

Top concepts

Publications per year

2004–2006

2

Publications

2

Thermal gradient in solder joints under electrical-current stressing

T. L. Shao, S. H. Chiu, Chih Chen et al. · Journal of Electronic Materials · 2004 · 31 citations

, , +7

Temperature and current-density distributions in flip-chip solder joints with Cu traces

C. Y. Hsu, D. J. Yao, S. W. Liang et al. · Journal of Electronic Materials · 2006 · 10 citations

, , +9

1–2 of 2