Concepedia

Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin–lead solder

D.C. Lin, Gang Wang, T. S. Srivatsan, Meslet Al‐Hajri, M. Petraroli

Materials Letters · 2003 · 85 citations · 6 references

DOI

Concepts

References

6

The formation and growth of intermetallics in composite solder

Yujing Wu, Jennifer A. Sees, Cyrus Pouraghabagher et al. · Journal of Electronic Materials · 1993 · 141 citations

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New, creep-resistant, low melting point solders with ultrafine oxide dispersions

H. Mavoori, S. Jin · Journal of Electronic Materials · 1998 · 125 citations

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Composite solders

James L. Marshall, Jose G. Calderon, Jennifer A. Sees et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1991 · 47 citations

, , +13

Composite solders

James L. Marshall, Jose G. Calderon, Denis E. Miiller et al. · Electronic Components and Technology Conference · 1991 · 45 citations

, , +11

Hard‐particle Reinforced Composite Solders Part 1: Microcharacterisation

James L. Marshall, Jose G. Calderon · Soldering and Surface Mount Technology · 1997 · 44 citations

, , +14