Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin–lead solder

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New, creep-resistant, low melting point solders with ultrafine oxide dispersions H. Mavoori, S. Jin Journal of Electronic Materials Materials ScienceMaterials EngineeringEngineeringApplied PhysicsPoint Solders	1998	125
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Hard‐particle Reinforced Composite Solders Part 1: Microcharacterisation James L. Marshall, Jose G. Calderon Soldering and Surface Mount Technology Materials ScienceChemical EngineeringReinforcement MaterialEngineeringPowder Metallurgy	1997	44
A Mössbauer Study of Tin-Based Intermetallics Formed During the Manufacture of Dispersion-Strengthened Composite Solders Robert C. Reno, M. J. Panunto, B. Piekarski Journal of Electronic Materials Materials EngineeringMaterials ScienceEngineeringPowder MetallurgyMechanical Engineering	1997	27

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