D.C. Lin - Concepedia

Author

D.C. Lin

University of Akron

Also Known As

D Lin, D. C. Lin, D. Lin, D.C. Lin, Dechao Lin

Publications

625

Citations

H-Index

Concepts

All Affiliations

University of Akron Southern Methodist University Timken (United States)

About

D.C. Lin is an author at University of Akron specializing in engineering, mechanical engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	10	587
2	Materials Engineering	5	5	209
3	Applied Physics	1	1	11
4	Chemistry	1	1	87
5	Electrical Engineering	1	1	11

D.C. Lin

Publications

587

Citations

H-Index

Page 1

	Year	Citations
Numerical and Experimental Investigations on the Loads Carried by the Tool During Friction Stir Welding Hosein Atharifar, D.C. Lin, Radovan Kovacevic Journal of Materials Engineering and Performance Friction WeldingEngineeringLoads CarriedWelding ProcessMechanics	2008	141
A mechanism for the formation of equiaxed grains in welds of aluminum–lithium alloy 2090 D.C. Lin, G.-X. Wang, T. S. Srivatsan Materials Science and Engineering A Materials ScienceEngineeringWelding ProcessEquiaxed GrainsMechanical Engineering	2003	95
An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder D.C. Lin, S. Liu, Tengying Guo, Materials Science and Engineering A Materials ScienceEngineeringNanomaterialsSolidification KineticsTin–lead Solder	2003	87
Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin–lead solder D.C. Lin, Gang Wang, T. S. Srivatsan, Materials Letters Materials ScienceMaterials EngineeringEngineeringMaterial ProcessingMechanical Properties	2003	85
The influence of copper nanopowders on microstructure and hardness of lead–tin solder D.C. Lin, Guan-bo WANG, T. S. Srivatsan, Materials Letters Materials ScienceMaterials EngineeringLead–tin SolderEngineeringNanomaterials	2002	71
Application of vibration in the laser powder deposition process Ehsan Foroozmehr, D.C. Lin, Radovan Kovacevic Journal of Manufacturing Processes Materials ScienceAdvanced Laser ProcessingEngineeringMechanical EngineeringLaser Processing Technology	2009	29
Modeling of temperature field and grain growth of a dual phase steel DP980 in direct diode laser heat treatment Fanrong Kong, Soundarapandian Santhanakrishnan, D.C. Lin, Journal of Materials Processing Technology EngineeringGrain GrowthMechanical EngineeringLaser Processing TechnologyHeat Treating	2009	26
Microstructural development in a rapidly cooled eutectic Sn–3.5% Ag solder reinforced with copper powder D.C. Lin, T. S. Srivatsan, G.-X. Wang, Powder Technology Materials EngineeringMaterials ScienceEngineeringPowder MetallurgyMechanical Engineering	2006	22
Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder D.C. Lin, T. S. Srivatsan, Guixue Wang, Journal of Materials Engineering and Performance Materials ScienceMaterials EngineeringEngineeringPowder MetallurgyMetal Nanoparticles	2007	20
Fluxless flip-chip attachment techniques using the Au/Sn metallurgy Christine Kallmayer, D.C. Lin, J. Kloeser, EngineeringMechanical EngineeringAdvanced Packaging (Semiconductors)Electronic PackagingInfrared Oven	2002	11

Page 1