The influence of copper nanopowders on microstructure and hardness of lead–tin solder - Concepedia

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The influence of copper nanopowders on microstructure and hardness of lead–tin solder

71

Citations

6

References

2002

Year

D.C. Lin, Guan-bo WANG, T. S. Srivatsan, Meslet Al‐Hajri, M. Petraroli

Materials Letters

Materials ScienceMaterials EngineeringLead–tin SolderEngineeringNanomaterialsMechanical EngineeringMetallurgical ProcessCopper NanopowdersMicrostructureMetal Processing

References

	Year	Citations

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