Concepedia

An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder

D.C. Lin, S. Liu, Tengying Guo, G.-X. Wang, T. S. Srivatsan, M. Petraroli

Materials Science and Engineering A · 2003 · 87 citations · 7 references

DOI

Concepts

References

7

Modelling of microstructure formation in solidification processes

M. Rappaz · International Materials Reviews · 1989 · 514 citations · Full text

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The formation and growth of intermetallics in composite solder

Yujing Wu, Jennifer A. Sees, Cyrus Pouraghabagher et al. · Journal of Electronic Materials · 1993 · 141 citations

, , +11

New, creep-resistant, low melting point solders with ultrafine oxide dispersions

H. Mavoori, S. Jin · Journal of Electronic Materials · 1998 · 125 citations

, , +14

The influence of copper nanopowders on microstructure and hardness of lead–tin solder

D.C. Lin, Guan-bo WANG, T. S. Srivatsan et al. · Materials Letters · 2002 · 71 citations

, , +12

Composite solders

James L. Marshall, Jose G. Calderon, Jennifer A. Sees et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1991 · 47 citations

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