An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder - Concepedia

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An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder

87

Citations

7

References

2003

Year

D.C. Lin, S. Liu, Tengying Guo, G.-X. Wang, T. S. Srivatsan, M. Petraroli

Materials Science and Engineering A

Materials ScienceEngineeringNanomaterialsSolidification KineticsTin–lead SolderPowder SynthesisChemistrySolidificationNanoparticles AdditionMicrostructureMetal Processing

References

	Year	Citations

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