Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging

Lead (Pb)-free solders for electronic packaging

Sung K. Kang, Amit Sarkhel · Journal of Electronic Materials · 1994 · 333 citations

Agriculture, Materials Engineering, Materials Science +8

Microstructure evolution of eutectic Sn-Ag solder joints

Wenge Yang, Robert W. Messler, L.E. Felton · Journal of Electronic Materials · 1994 · 272 citations

Natural Sciences, Materials Engineering, Materials Science +14

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

Natural Sciences, Materials Engineering, Materials Science +9

Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings

Paul T. Vianco, Paul F. Hlava, Alice C. Kilgo · Journal of Electronic Materials · 1994 · 192 citations

Natural Sciences, Materials Engineering, Materials Science +16

New Pb-free solder alloy with superior mechanical properties

M. McCormack, S. Jin, G. W. Kammlott et al. · Applied Physics Letters · 1993 · 189 citations

Natural Sciences, Materials Engineering, Materials Science +17