Water soluble and metal-containing electron beam resist poly(sodium 4-styrenesulfonate)

Abstract

Popular electron beam resists such as PMMA, ZEP and HSQ all use solvent or base solutions for processing, which may attack the sub-layers or substrate that are made out of organic semiconducting materials. In this study we show that water soluble poly(sodium 4-styrenesulfonate), or sodium PSS, can be used as a negative electron beam resist developed in water. Moreover, since PSS contains metal sodium, its dry etching resistance is much higher than PMMA. It is notable that sodium PSS's sensitivity and contrast is still far inferior to organic resists such as PMMA, thus it is not suitable for patterning dense and high-resolution structures. Nevertheless, feature size down to 40 nm was achieved for sparse patterns. Lastly, using very low energy (here 2 keV) electron beam lithography and liftoff process using water only, patterning of metal layer on an organic conductive material P3HT was achieved. The metallization of an organic conducting material may find applications in organic semiconductor devices such as OLED.