Electromigration-induced failures in interconnects with bimodal grain size distributions

Electromigration Damage in Aluminum Film Conductors

M. J. Attardo, R. Rosenberg · Journal of Applied Physics · 1970 · 264 citations

Engineering, Fine-grain Aluminum Films, Flux Divergences +18

Grain size dependence of electromigration-induced failures in narrow interconnects

J. Cho, Carl V. Thompson · Applied Physics Letters · 1989 · 206 citations

Engineering, Median Time, Grain Size Dependence +18

Statistical Metallurgical Model for Electromigration Failure in Aluminum Thin-Film Conductors

M. J. Attardo, Richard E. Rutledge, Raymond Jack · Journal of Applied Physics · 1971 · 122 citations

Engineering, Mechanical Engineering, Corrosion +22

Anomalous large grains in alloyed aluminum thin films I. Secondary grain growth in aluminum-copper films

A. Gangulee, F. M. d’Heurle · Thin Solid Films · 1972 · 76 citations

Materials Science, Materials Engineering, Aluminum-copper Films +11

A new electromigration testing technique for rapid statistical evaluation of interconnect technology

Carl V. Thompson, J. Cho · IEEE Electron Device Letters · 1986 · 49 citations

Engineering, Mechanical Engineering, Test Structure +19