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<title>SPEEDIE: a profile simulator for etching and deposition</title>
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1991
Year
EngineeringVacuum DeviceInterface (Computing)Plasma ProcessingNumerical SimulationDry EtchingTransport PhenomenaModeling And SimulationProfile SimulatorElectronic PackagingElectrical EngineeringMonte CarloComputer EngineeringMultiphase FlowMicroelectronicsPlasma EtchingMicrofabricationSurface ScienceApplied Physics
SPEEDIE is a new physically based profile simulator for dry etching and LPCVD. It calculates angular and energy distributions of ions and fast neutrals using a Monte Carlo (MC) simulator for ion sheath transport. Fluxes at each point on the profile can be calculated using either MC or analytical methods which consider 3-D transport by molecular flow surface diffusion and adsorption/re-emission. Etch rates are determined using a choice of etch models while LPCVD uses a sticking coefficient model. A modified string algorithm which allows simultaneous etching and deposition is used to move the surface. Examples which match experiments are given for sloped oxide etching and oxide filling of trenches and vias.