Metal printing of copper interconnects down to 500nm using ECPR – Electrochemical pattern replication

SOFT LITHOGRAPHY

Younan Xia, George M. Whitesides · Annual Review of Materials Science · 1998 · 4.6K citations

Engineering, Materials Engineering, Materials Science +16

Imprint of sub-25 nm vias and trenches in polymers

Stephen Y. Chou, Peter R. Krauss, Preston J. Renstrom · Applied Physics Letters · 1995 · 2.7K citations

Engineering, Manufacturing Engineering, Materials Science +15

Printing meets lithography: Soft approaches to high-resolution patterning

Bruno Michel, André Bernard, Alexander Bietsch et al. · IBM Journal of Research and Development · 2001 · 464 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Lift-off process for nanoimprint lithography

Patrick Carlberg, Mariusz Graczyk, E.-L. Sarwe et al. · Microelectronic Engineering · 2003 · 49 citations

Engineering, Materials Engineering, Materials Science +14

Analysis of critical dimension uniformity for Step and Flash imprint lithography

David P. Mancini, Kathleen A. Gehoski, William J. Dauksher et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2003 · 13 citations

Engineering, Materials Engineering, Materials Science +14