Processing mechanics for flip-chip assemblies

Book Reviews : NUMERICAL METHODS IN FINITE ELEMENT ANALYSIS K.-J. Bathe and E.L. Wilson Prentice-Hall, Inc, Englewood Cliffs, NJ

H. Saunders · The Shock and Vibration Digest · 1978 · 884 citations

Numerical Analysis, Finite Element Method, Numerical Computation +7

Behavior of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption, and wave soldering

Sheng Liu, Yuhai Mei · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 115 citations

Engineering, Food Packaging, Mechanical Engineering +22

Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation

Yifan Guo, C. K. Lim, W. T. Chen et al. · IBM Journal of Research and Development · 1993 · 113 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +17

Bimaterial interfacial crack growth as a function of mode-mixity

Sheng Liu, Yuhai Mei, T. Y. Wu · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 105 citations

Materials Science, Energy Release Rate, Engineering +15

Manufacturing Science and Engineering

Precision Engineering · 1994 · 71 citations

Engineering, Industrial Engineering, Digital Manufacturing +3