Concepedia

C. K. Lim

CK

6

Publications

225

Citations

6

H-Index

1984

Active since

Affiliations

IBM (United States)(Current)

Endicott College

C. K. Lim is an author at IBM (United States) specializing in mechanical engineering, engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringElectronic PackagingMaterial ScienceMechanics Of MaterialsSolid MechanicsMicroelectronicsMechanicsApplied PhysicsMicrofabrication

Publications per year

1984–2012

6

Publications

6

Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation

Yifan Guo, C. K. Lim, W. T. Chen et al. · IBM Journal of Research and Development · 1993 · 113 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +17

Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

Bongtae Han, Yifan Guo, C. K. Lim et al. · Journal of Electronic Packaging · 1996 · 55 citations

Engineering, Optical Testing, Mechanical Engineering +25

Low cycle fatigue life prediction using a four-bolt extended unstiffened end plate moment connection

C. K. Lim, Wonchang Choi, Emmett A. Sumner · Engineering Structures · 2012 · 17 citations

Fatigue Management, Engineering, Service Life Prediction +5

Micromechanics of multilayer printed circuit boards

L. C. Lee, V. S. Darekar, C. K. Lim · IBM Journal of Research and Development · 1984 · 15 citations

Engineering, Circuit Boards, Mechanical Engineering +19

Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations

Hee Cheul Choi, Yifan Guo, W. R. LaFontaine et al. · IBM Journal of Research and Development · 1993 · 13 citations

Engineering, Mechanical Engineering, Whole-field Strain Distribution +18

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