Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations

Abstract

A novel approach to processing interferometric moiré images, called computational Fourier transform moiré, has been developed. The essential principle of this technique is to automatically calculate a whole-field strain from digitized images of interferometric moiré fringes using digital Fourier transform procedures. With the use of this technique, a whole-field strain distribution of a Solder Ball Connect (SBC) interconnection under thermal loading was obtained. The calculated strain field was then used to understand fatigue modes of SBC observed from an accelerated thermal cycling (ATC) test.