Daqing Zou

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

J. Wang, Zhengfang Qian, Daqing Zou et al. · Journal of Electronic Packaging · 1998 · 43 citations

Engineering, Mechanical Engineering, Fem Modeling +17

Investigation of interfacial fracture behavior of a flip-chip package under a constant concentrated load

Jianjun Wang, Minfu Lu, Daqing Zou et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1998 · 36 citations

Engineering, Mechanical Engineering, Crack Propagation +17

A study of the mixed-mode interfacial fracture toughness of adhesive joints using a multiaxial fatigue tester

Jianjun Wang, Minfu Lu, Ren Wei et al. · IEEE Transactions on Electronics Packaging Manufacturing · 1999 · 29 citations

Engineering, Moire Interferometry Technique, Mechanical Engineering +17

Processing mechanics for flip-chip assemblies

J. Wang, W. Ren, Daqing Zou et al. · Computers & Structures · 1999 · 26 citations

Chip-scale Package, Engineering, Microfabrication +6

Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

Jianjun Wang, Daqing Zou, Minfu Lu et al. · Engineering Fracture Mechanics · 1999 · 25 citations

Materials Science, Chip-scale Package, Engineering +13