Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces

Panos G. Charalambides, J. A. Lund, A.G. Evans et al. · Journal of Applied Mechanics · 1989 · 904 citations

Finite Element Approach, Engineering, Mechanical Engineering +16

On the calculation of energy release rates for cracked laminates

J. G. Williams · International Journal of Fracture · 1988 · 488 citations

Damage Mechanism, Engineering, Energy Release Rates +9

The thermomechanical integrity of thin films and multilayers

A.G. Evans, J.W. Hutchinson · Acta Metallurgica et Materialia · 1995 · 433 citations

Materials Science, Engineering, Applied Physics +4

Sandwich test specimens for measuring interface crack toughness

Zhigang Suo, John W. Hutchinson · Materials Science and Engineering A · 1989 · 432 citations

Engineering, Nondestructive Testing, Mechanical Engineering +6

Delamination Specimens for Orthotropic Materials

Zhigang Suo · Journal of Applied Mechanics · 1990 · 188 citations

Infinite Strip, Engineering, Mechanical Engineering +17