Concepedia

Wei Ren

WR

13

Publications

350

Citations

11

H-Index

1997

Active since

Affiliations

Wayne State University(Current)

China University of Petroleum, Beijing

Shanghai Jiao Tong University

Ford Motor Company (United States)

Wei Ren is an author at Wayne State University specializing in mechanical engineering, engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringElectronic PackagingMechanics Of MaterialsMaterial ScienceSolid MechanicsHeat TransferMicrostructureMicrofabricationFracture Mechanics

Publications per year

1997–2023

13

Publications

13

Sodium‐glucose co‐transporter ( <scp>SGLT</scp> ) and glucose transporter ( <scp>GLUT</scp> ) expression in the kidney of type 2 diabetic subjects

Luke Norton, Chris E. Shannon, Marcel Fourcaudot et al. · Diabetes Obesity and Metabolism · 2017 · 88 citations

Investigation of electronic packaging materials by using a 6-axis mini thermo-mechanical tester

Minfu Lu, Zhengfang Qian, Wei Ren et al. · International Journal of Solids and Structures · 1999 · 41 citations

Materials Science, Materials Engineering, Chip-scale Package +11

Investigation of the tensile strain response of the girth weld of high-strength steel pipeline

Yinhui Zhang, Jian Shuai, Wei Ren et al. · Journal of Constructional Steel Research · 2021 · 40 citations

Engineering, Tensile Strain Response, High-strength Steel Pipeline +9

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending

Leon Xu, T. Reinikainen, Wei Ren et al. · Microelectronics Reliability · 2004 · 34 citations

Industrial Design, Engineering, Advanced Packaging (Semiconductors) +13

Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

Jianjun Wang, Daqing Zou, Minfu Lu et al. · Engineering Fracture Mechanics · 1999 · 25 citations

Materials Science, Chip-scale Package, Engineering +13

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