Leon Xu

A roadmap for STEP-NC-enabled interoperable manufacturing

Martin Hardwick, Yaoyao Fiona Zhao, Fred Proctor et al. · The International Journal of Advanced Manufacturing Technology · 2013 · 57 citations · Full text

Engineering, Industrial Engineering, Manufacturing Engineering +12

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending

Leon Xu, T. Reinikainen, Wei Ren et al. · Microelectronics Reliability · 2004 · 34 citations

Architecture, Computational Engineering, Design +16

Optimal Parameter Selection for Electronic Packaging Using Sequential Computer Simulations

Abhishek Gupta, Yu Ding, Leon Xu et al. · Journal of Manufacturing Science and Engineering · 2005 · 25 citations

Computing, Computational Engineering, Systems Engineering +15

A novel response surface method for design optimization of electronic packages

Bo Ping Wang, Zhen Han, Leon Xu et al. · 2005 · 20 citations

Architecture, Computational Engineering, Computer-aided Design +13

Numerical studies of the mechanical response of solder joint to drop/impact load

Leon Xu, J. H. Wang, T. Reinikainen et al. · 2004 · 18 citations

Engineering, Materials Engineering, Materials Science +17