Effect of surfactant on surface quality of silicon microstructures etched in saturated TMAHW solutions

TMAH/IPA anisotropic etching characteristics

Á. Merlos, M.C. Acero, Ming Bao et al. · Sensors and Actuators A Physical · 1993 · 183 citations

Engineering, Materials Engineering, Materials Science +9

Compensating corner undercutting in anisotropic etching of (100) silicon

Xian-Ping Wu, Wen H. Ko · Sensors and Actuators · 1989 · 107 citations

Engineering, Materials Engineering, Materials Science +8

Hybrid postprocessing etching for CMOS-compatible MEMS

N. H. Tea, V. Milanović, C. Zincke et al. · Journal of Microelectromechanical Systems · 1997 · 85 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Anisotropic etching of surfactant-added TMAH solution

Masayuki Sekimura · 1999 · 54 citations

Engineering, Materials Engineering, Materials Science +17

Anisotropy and selectivity control of TMAH

Osamu Tabata · 2002 · 15 citations

Engineering, Materials Engineering, Materials Science +13