Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1998 · 10 citations · 8 references
Natural SciencesMaterials EngineeringMaterials ScienceMaterials CharacterizationSurface ScienceThin FilmsChemical Vapor DepositionPhysical Vapor DepositionSurface PhysicsThin Film AdhesionThin Film Electrical PropertiesThin-film MaterialsAdhesion LayersElectrical PropertiesElectrical ResistivityFilm Growth MechanismsFilm ThicknessFilm Thickness ControlMetalorganic Chemical Vapor DepositionPhysical Vapor Deposition Adhesion
The structure and electrical properties of chemical vapor deposited W (CVD-W) films on various physical vapor deposited or metalorganic chemical vapor deposited TiN films have been investigated. The growth orientations of the TiN adhesion layers were controlled by deposition method and film thickness. The growth orientations of CVD-W films were found to depend strongly on the microstructures of TiN. The grain sizes and electrical resistivity of CVD-W were found to increase and decrease, respectively, with the grain sizes of underlying TiN layers.
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