Lifetime extrapolation for IGBT modules under realistic operation conditions

On the effect of power cycling stress on IGBT modules

P. Cova, F. Fantini · Microelectronics Reliability · 1998 · 82 citations · Full text

Engineering, Electrical Engineering, Microelectronics +11

Advanced IGBT modules for railway traction applications: Reliability testing

H. Berg, E. Wolfgang · Microelectronics Reliability · 1998 · 63 citations

Engineering, Electrical Engineering, Electronic Materials +13

PLASTIC-STRAIN OF ALUMINIUM INTERCONNECTIONS DURING PULSED OPERATION OF IGBT MULTICHIP MODULES

Mauro Ciappa, P. Malberti · Quality and Reliability Engineering International · 1996 · 45 citations

Engineering, Electrical Engineering, Materials Science +17

Thermal characterization of IGBT power modules

P. Cova, Mauro Ciappa, G. Franceschini et al. · Microelectronics Reliability · 1997 · 22 citations · Full text

Engineering, Electrical Engineering, Materials Science +14