Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 589 citations

Engineering, Materials Engineering, Materials Science +10

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14

Wetting and interface microstructure between Sn–Zn binary alloys and Cu

Katsuaki Suganuma, Koichi Niihara, Takeshi Shoutoku et al. · Journal of materials research/Pratt's guide to venture capital sources · 1998 · 216 citations

Natural Sciences, Materials Engineering, Materials Science +14

Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating

Katsuaki Suganuma, Toshikazu Murata, Hiroji Noguchi et al. · Journal of materials research/Pratt's guide to venture capital sources · 2000 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +16

Alloy design of Zn–Al–Cu solder for ultra high temperatures

Namhyun Kang, Hye Sung Na, Seong Jun Kim et al. · Journal of Alloys and Compounds · 2007 · 125 citations

Natural Sciences, Materials Engineering, Materials Science +14