Statistics
Publications
2
Citations
41
H-Index
2
Active since
2013
Affiliations
S. W. Park is an author at The University of Osaka specializing in natural sciences, materials engineering, and solder pastes.
Publications per year
2013–2014
2
2
Low-pressure sintering bonding with Cu and CuO flake paste for power devices
S. W. Park, R. Uwataki, Shijo Nagao et al. · 2014 · 16 citations
Natural Sciences, Materials Engineering, Materials Science +16
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