Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the sn-rich corner

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Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

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Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

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Natural Sciences, Materials Engineering, Materials Science +13

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Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

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