Journal of Applied Physics · 2005 · 33 citations · 23 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMaterials CharacterizationSemiconductor MaterialsDefects In Electronic MaterialsDislocations In SemiconductorsElastic DeformationResidual StressSemiconductor DefectsStrain AnalysisElastic StrainHigh-resolution X-ray DiffractionPoint DefectsResidual StrainScrew DislocationsStrain RelaxationThermal Expansion MismatchThreading Dislocations
We report high resolution x-ray diffraction studies of the relaxation of elastic strain in GaN grown on SiC(0001). The GaN layers were grown with thickness ranging from 0.29to30μm. High level of residual elastic strain was found in thin (0.29to0.73μm thick) GaN layers. This correlates with low density of threading screw dislocations of 1-2×107cm−2, observed in a surface layer formed over a defective nucleation layer. Stress was found to be very close to what is expected from thermal expansion mismatch between the GaN and SiC. A model based on generation and diffusion of point defects accounts for these observations.
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GaN: Processing, defects, and devices
S. J. Pearton, J.C. Zolper, R. J. Shul et al. · Journal of Applied Physics · 1999 · 1.8K citations
III–nitrides: Growth, characterization, and properties
S.C. Jain, M. Willander, J. Narayan et al. · Journal of Applied Physics · 2000 · 1.3K citations
Strain-related phenomena in GaN thin films
C. Kisielowski, Joachim Krüger, S. Ruvimov et al. · Physical review. B, Condensed matter · 1996 · 886 citations
Natural Sciences, Materials Engineering, Materials Science +17