Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing

Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters · 2002 · 361 citations

Electrical Engineering, Electromigration Technique, Engineering +12

Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging

Hui-Wei Miao, Jenq‐Gong Duh · Materials Chemistry and Physics · 2001 · 156 citations

Materials Science, Materials Engineering, Engineering +7

Electromigration in Sn–Pb solder strips as a function of alloy composition

C. Y. Liu, Chih Chen, K. N. Tu · Journal of Applied Physics · 2000 · 152 citations

Engineering, Alloy Composition, Lamella Interfaces +16

Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Yu Hu, Yuan Lin, C. R. Kao et al. · Journal of materials research/Pratt's guide to venture capital sources · 2003 · 135 citations

Materials Science, Electromigration Technique, Engineering +6

Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect

Qi‐Liang Yang, Jin Shang · Journal of Electronic Materials · 2005 · 97 citations

Materials Science, Electrical Engineering, Electromigration Technique +10