Kuen-Ming Liou

Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing

Chih‐Ming Chen, Chih-chieh Huang, Chien‐Neng Liao et al. · Journal of Electronic Materials · 2007 · 38 citations

Materials Science, Materials Engineering, Electrical Engineering +12

Enhancement of thermoelectric properties of sputtered Bi–Sb–Te thin films by electric current stressing

Chien‐Neng Liao, Kuen-Ming Liou, Hsu-Shen Chu · Applied Physics Letters · 2008 · 32 citations

Materials Science, Semiconductors, Thin Film Physics +14

Electric current enhanced defect elimination in thermally annealed Bi–Sb–Te and Bi–Se–Te thermoelectric thin films

Kuen-Ming Liou, Chien‐Neng Liao · Journal of Applied Physics · 2010 · 25 citations

Engineering, Thermoelectrics, Thin Film Process Technology +16

Electrical and thermal transport properties of electrically stressed Bi–Sb–Te nanocrystalline thin films

Chien‐Neng Liao, Xiaowei Su, Kuen-Ming Liou et al. · Thin Solid Films · 2011 · 16 citations

Materials Science, Electrical Engineering, Engineering +9